Qualcomm has unveiled its powerful new Snapdragon X2 Plus chip at CES 2026, marking a significant step forward for laptop performance. Built on an advanced 3nm process, this next-generation processor arrives in two main versions: a robust 10-core model (X2P-64-100) and an efficient 6-core variant (X2P-42-100). Enthusiasts and professionals can look forward to seeing the first devices featuring the Snapdragon X2 Plus hit the market as early as late March 2026. Let’s explore the groundbreaking features and capabilities this new chip brings to the table.
Powering Next-Gen Laptops
The Snapdragon X2 Plus aims to redefine what’s possible in mobile computing. Designed for peak performance and efficiency, both versions are crafted to deliver a seamless user experience across a range of tasks.
Core Performance and Architecture
The 10-core Snapdragon X2 Plus is equipped with a sophisticated setup: six prime cores blazing at up to 4.0GHz for demanding applications, complemented by four performance cores running at 3.4GHz. This configuration boasts a total of 34MB of cache, ensuring rapid data access. The 6-core version, on the other hand, focuses its power through its six prime cores. Both chips leverage Qualcomm’s cutting-edge 3rd-generation Oryon CPU architecture, a foundation for their impressive capabilities.
Early benchmarks suggest remarkable performance enhancements. The 10-core model, for instance, shows a multi-core performance boost of up to 17% over its predecessor, while the 6-core variant sees gains of up to 10%. Single-core performance across the board is projected to be up to 35% higher compared to the previous Snapdragon X Plus, according to Geekbench 6.5 results.
Stunning Graphics with Adreno
Visual experiences are set to improve dramatically with the integrated Adreno X2-45 GPU. The 10-core chip drives graphics at a swift 1.7 GHz, while the 6-core version operates at 0.9 GHz. Graphics benchmarks indicate significant leaps, with the 10-core chip showing up to 29% better integrated GPU performance, and the 6-core chip impressing with up to a 39% increase in 3DMark Steel Nomad Light scores.
This new Adreno GPU supports the latest in graphics technology, including DX12 Ultimate, Vulkan 1.4, OpenCL 3.0, and Adreno High Performance Memory (HPM), alongside notable improvements in ray tracing capabilities.
Unprecedented AI Capabilities
In line with the growing focus on artificial intelligence, the Snapdragon X2 Plus integrates an NPU (Neural Processing Unit) that delivers an astounding 80 TOPS (Tera Operations Per Second) of AI compute power. This makes it a leading platform for AI acceleration in laptops, representing a substantial upgrade from the previous generation’s 45 TOPS and paving the way for more sophisticated on-device AI applications.
Advanced Connectivity and Memory
The chip supports up to 128GB of LPDDR5X memory, operating at speeds of up to 9523 MT/s over a 128-bit bus, which translates to a blazing 152 GB/s of bandwidth. This is a significant improvement over prior memory speeds.
For connectivity, the Snapdragon X2 Plus incorporates the Snapdragon X75 5G modem, enabling peak download speeds of up to 10Gbps and upload speeds of 3.5Gbps. Modern wireless standards like Wi-Fi 7 and Bluetooth 5.4 are built-in, with optional 5G support. Devices powered by the chip can also support up to three USB-C ports and drive up to three 4K displays simultaneously at a smooth 144Hz refresh rate.
Robust Security Features
Security is a core focus, with the Snapdragon X2 Plus featuring Qualcomm’s Security Processor Unit (SPU) integrated with Microsoft Pluton for comprehensive chip-to-cloud protection. The platform offers biometric authentication, automatic presence detection, and advanced safeguards for sensitive data. For enterprise users, optional Snapdragon Guardian Technology provides business-grade protection and Out-of-Band (OOB) remote manageability for seamless security updates and maintenance.
Key Technical Details
- Manufacturing Process: 3nm
- CPU Architecture: 3rd-generation Qualcomm Oryon (10-core or 6-core variants, up to 4.0 GHz)
- Graphics: Qualcomm Adreno X2-45 GPU (1.7 GHz for 10-core, 0.9 GHz for 6-core)
- AI Engine: Qualcomm Hexagon NPU, delivering 80 TOPS
- Memory Support: LPDDR5X up to 9523 MT/s, supporting up to 128 GB
- Modem: Snapdragon X75 5G Modem-RF System (up to 10Gbps download, 3.5Gbps upload)
- Wireless Connectivity: Wi-Fi 7 (FastConnect 7800), Bluetooth 5.4
- Display Output: Supports up to three 4K 144Hz panels concurrently
- Security Features: Qualcomm SPU with Microsoft Pluton, biometric authentication, automatic presence detection
- Peripheral Connectivity: Up to three USB-C ports
Availability
The initial wave of laptops powered by the Qualcomm Snapdragon X2 Plus is anticipated to launch in the first half of 2026, with the earliest models expected to appear by late March 2026. Consumers can look forward to a range of devices, with pricing likely starting around USD 800.
Conclusion
The Qualcomm Snapdragon X2 Plus represents a significant leap forward in mobile processor technology. With its advanced 3nm architecture, enhanced CPU and GPU performance, leading-edge AI capabilities, and robust security features, it’s poised to power a new generation of laptops. These innovations promise to deliver faster, more efficient, and more intelligent computing experiences for users, setting a new benchmark for what’s expected from high-performance portable devices.